The global Redistribution Layer Material market accounted for US$ 105.4 Mn in 2018 and is expected to grow at a CAGR of 25.7% over the forecast period 2019–2027, to account for US$ 794.5 Mn by 2027. The demand for redistribution layer material is largely influenced by the rising applications in consumer electronics devices, data centers, IoT sensors and communication devices across the globe. The rising number of consumer electronic devices and rapid adoptions of cloud storages would drive the redistribution layer material market.
The advent of IoT has enabled each device to be connected over the internet and the rising adoptions globally would result in more than billions of devices connected over the internet. Also, validating to the above mentioned point is the fact that the data traffic rate on a global level, has grown at an annual rate of more than 65% over the last five years.
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The over all Redistribution Layer Material market size has been derived using both primary and secondary source. The research process begins with exhaustive secondary research using internal and external sources to obtain qualitative and quantitative information related to the redistribution layer material market.
It also provides the overview and forecast for the global redistribution layer material market based on all the segmentation provided with respect to five major reasons such as North America, Europe, Asia-Pacific, Rest of World (RoW). Also, primary interviews were conducted with industry participants and commentators in order to validate data and analysis.
The participants who typically take part in such a process include industry expert such as VPs, business development managers, market intelligence managers, and national sales managers, and external consultants such as valuation experts, research analysts, and key opinion leaders specializing in the Redistribution Layer Material industry.
Some of the players present in the redistribution layer material market are NXP Semiconductors N.V., Samsung Electronics Co. Ltd, Shin-Etsu Chemical Co., Ltd., SK HYNIX INC., Sumitomo Bakelite Co., Ltd, The Dow Chemical Company, Toray Industries, Inc., and Taiwan Semiconductor Manufacturing Company Ltd. Among others, Fujifilm Holdings Corporation, Hitachi Chemical DuPont MicroSystems L.L.C., and Infineon Technologies AG are other prominent players in the redistribution layer material market.
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Table of content
TABLE OF CONTENTS
1.1 SCOPE OF THE STUDY
1.2 THE INSIGHT PARTNERS RESEARCH REPORT GUIDANCE
2. KEY TAKEAWAYS
3. RESEARCH METHODOLOGY
3.1.2 Secondary Research
3.1.3 Primary Research
4. REDISTRIBUTION LAYER MATERIAL MARKET — PREMIUM INSIGHTS
4.1 OTHER RDL APPLICATIONS
4.1.1 CIS Packaging RDL
4.1.2 PLP Packaging RDL
4.2 RDL TECHNOLOGY OUTLOOK
4.2.1 Wafer Level Packaging (WLP)
126.96.36.199 Wafer-Level Chip Scale Packaging (WLCSP)
188.8.131.52 Fan-Out Wafer-Level Chip Scale Packaging (WLCSP)
4.2.2 Through Silicon Vias (TSV)
4.2.3 Copper Pillar
4.2.4 Solder Bump
5. REDISTRIBUTION LAYER MATERIAL MARKET LANDSCAPE
5.1.1 Global Redistribution Layer Material Market — By Material
5.1.2 Global Redistribution Layer Material Market — By Application
184.108.40.206 Global Redistribution Layer Material Market — By 2.5D/3D IC Packaging
5.1.3 Global Redistribution Layer Material Market — By Geography
5.2 PEST ANALYSIS
5.2.1 North America PEST Analysis
5.2.2 Europe PEST Analysis
5.2.3 Asia Pacific PEST Analysis
5.2.4 Rest of World PEST Analysis
6. REDISTRIBUTION LAYER MATERIAL MARKET — KEY INDUSTRY DYNAMICS
6.1 KEY MARKET DRIVERS
6.1.1 Growing trends of miniaturization of consumer electronic devices
6.1.2 Increasing automation integrations in the highly prominent manufacturing sector worldwide
6.2 KEY MARKET RESTRAINTS
6.2.1 Higher costs incurred and O&M complexities
6.3 KEY MARKET OPPORTUNITIES
6.3.1 Proliferation of IoT and connected devices across industry verticals
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