ESD Packaging Market Outlook, Strategies, Industry Analysis, Future Scope, Key Drivers By forecast 2023
Summary
The sudden challenges created by the ongoing COVID-19 are captured effectively to exhibit the long term growth projections in the MRFR report on Electronic Goods Packaging Market Size. The growth sectors of the ESD Packaging Market are identified with precision for a better growth perspective.
ESD Packaging Market Highlights
The ESD Packaging is also called as antistatic packaging. Static can be caused by various factors such as including other devices, friction or even the weather. Electrostatic discharge packaging is vital for the safe transportation and storage of most electronic products. Also, the operational requirement among original equipment manufacturers to isolate ESD sensitive items, components and devices during manufacturing, assembling and shipping has led to such specific packaging need catered by packaging manufacturers.
The global electrostatic discharge packaging market is expected to grow over the CAGR of around 8.2% during the period 2017 to 2023.
Market Research Analysis
Asia-Pacific region is expected to dominate the ESD Packaging Market with the highest CAGR, owing to factors such as growing demand for smartphones and IT infrastructure. The developing economies such as China and India are the major contributors to the growth of the market in the region. In addition, government initiatives such as Digital India is expected to propel the usage of smartphones in the country, as a result boosting the growth of electrostatic discharge packaging market.
Target Audience
Manufactures
Raw Materials Suppliers
Aftermarket suppliers
Research Institute / Education Institute
Potential Investors
Key executive (CEO and COO) and strategy growth manager
Key Players
The key players of the global ESD Packaging Market are Teknis Limited (U.K.), Tandem Equipment Sales, Inc. (U.S.), Summit Packaging Solutions (U.S.), Stephen Gould Corp. (U.S.), Statico (U.S.), Elcom UK Ltd (U.K.), Protektive Pak (U.S.), GWP Group Limited (U.K.) and Desco Industries Inc. (U.S.).
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Scope of the Report
This study provides an overview of the global ESD Packaging Market, tracking two market segments across four geographic regions. The report studies key players, providing a five-year annual trend analysis that highlights market size, volume and share for Asia-Pacific, North America, Europe and Rest of the World (ROW). The report also provides a forecast, focusing on the market opportunities for the next five years for each region. The scope of the study segments the global electrostatic discharge packaging market by its product, end-users and region.
By Product
- Bags
- Trays
- Boxes & Containers
- ESD foams
- Others
By End-users
- Communication network infrastructure
- Consumer electronics
- Computer peripherals
- Automotive industry
- Others
By Region
- Asia Pacific
- North America
- Europe
- Rest of World
About Market Research Future
At Market Research Future (MRFR), we enable our customers to unravel the complexity of various industries through our Cooked Research Report (CRR), Half-Cooked Research Reports (HCRR), Raw Research Reports (3R), Continuous-Feed Research (CFR), and Market Research & Consulting Services.