(2020 - 2023) Global Advanced Packaging Market is Anticipated to Reach US$ 10.5% by 2023

Advanced Packaging Market (2020 – 2023) report provides the newest industry data and industry future trends, allowing you to identify the products and end users driving Revenue growth and profitability. The Advanced Packaging market report lists the leading competitors and provides the insights strategic industry Analysis of the key factors influencing the market.

Advanced Packaging Market report is anticipated to register a CAGR of 10.5% over a five years forecast period (2020 – 2023).”

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List of Major Key players operating in the Global Advanced Packaging Market are –

  • Amkor Technology Inc.
  • Taiwan Semiconductor Manufacturing Company
  • STATS ChipPAC Ltd
  • Advanced Semiconductor Engineering Inc.
  • United Microelectronics Corporation
  • Semiconductor Manufacturing International Corporation

The global advanced packaging market was valued at USD 3,358.1 million in 2017, and it is expected to reach a value of USD 6,254.6 million by 2023, at a CAGR of 10.5% during the forecast period (2020 - 2023). IC packaging in the semiconductor industry has witnessed continuous transformation in terms of characteristics, integration and energy efficiency of the product, owing to a vast demand across various end-user verticals of the industry. The 2-D integrated circuit (2.0DIC) flip-chip and wafer-level packaging technologies have witnessed solid growth over the years owing to a number of mainstream applications – primarily in high-end smartphones and tablets - that are expected to meet stringent size and power-management requirements. The 2.5DIC and 3.0DIC through silicon via (TSV) technology have emerged as attractive options to extend the flip-chip and wafer-level capabilities owing to their enhanced functionality. A majority of the IC manufacturers manage the front-end, while the middle- and back-end activities are performed by foundries that mainly specialize in outsourced assembly and testing (OSAT).

Growing Trend of Miniaturization Is Driving the Market

The industry has always been witnessing constant transitions, miniaturization of nodes and increasing size of wafers owing to the ULSI fabrication are driving the market growth. Increasing number of manufacturers offering innovative products are increasing as the companies are focused toward R&D. Growing consumer electronic users and consumer preference toward smaller, lighter and thinner products, with increased demand for tablets, smartphones and other connected devices, along with the increasing need for advanced architecture in electronic products, are also fueling the growth of this market.

Wafer-Level Chip-Scale Packaging Is the Fastest Growing Technology

Innovations in the semiconductor packaging technology are majorly based on the size of the wafer, thereby raising focus on the wafer-level packages, which has resulted in innovative packaging solutions in the chip industry. Manufacturers are keenly focused on the production of larger diameter wafers owing to the increasing demand. This is expected to reduce the costs incurred in manufacturing, and hence, is expected to lead to the development of advanced packaging solutions. The Fan out sub-segment technology is an emerging alternative solution to the 2.5D packaging, it can also handle multiple dies when compared to the fan-in wafer-level packaging, which can handle single die only. Fan-out technology is witnessing significant growth, as this eliminates the need for process flows that includes water fluxing, cleaning, curing, flip-chip assembly and under-fill dispensing.

Asia-Pacific Is Expected to Witness High Growth Rates

Asia-Pacific is expected to grow at a healthy rate, being a major revenue generating region during the forecast period. Presence of major players in this region and heavy investments in R&D for developing products with advanced features is fueling the growth of this market. China is a major contributor in this region, mainly driven by the policy framework released by the State Council of the People’s Republic of China in June 2014. This policy aims to make advanced packaging a technology priority across the semiconductor industry. To cater to the various advancements in consumer applications, such as, smartphones, tablets and wearable products, the MEMS and CIS markets are expected to exhibit robust growth during the forecast period, in turn, fueling the growth of the advanced packaging market. The growing demand for mobile/wireless sensor, CIS (Cogent Iris Scanner) and fingerprint sensors is expected to propel the Copper pillar and WLCSP growth in the region.

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Scope of the Report:

The report analyses Advanced Packaging market, which includes –

  • Analysis of the growth of Advanced Packaging market in global and regional level including Asia-Pacific, Americas, and EMEA.
  • The report provides Advanced Packaging market analysis for key countries including the US, Canada, Chile, China, India, Japan, the UK, Germany, France, and Italy.
  • The report offers country level Advanced Packaging market volume and value by end-user segment for the period 2012-2023.
  • Qualitative analysis of key market drivers and restraints, and analysis of their impacts on Advanced Packaging market are discussed.
  • The report provides competitive landscape at country level for the year 2020. It also covers key policies and initiatives, key deals, and key upcoming projects.

Highlighted points of Advanced Packaging Market Report:

  • Varying dynamics of the Advanced Packaging industry.
  • Prospective changes in sales volumes and worldwide share growth in upcoming years (2020-2023).
  • Advanced Packaging market report recognizes the key drivers of growth and challenges of the key industry players.
  • Competitors profiles along with product description, overview, and business data.
  • A complete analysis of market risks, opportunities, limitations, and growth of the market.
  • Market driving and restraining factors.
  • Delivers information on the historical and current market size and the future potential of the market.
  • Advanced Packaging market report provides a comprehensive analysis of the market with respect to market dynamics, competitive analysis, and upcoming trends of the market.

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Reasons to Purchase Advanced Packaging Market Report:

  • The report analyses how stringent emission control norms will drive the global Advanced Packaging market.
  • Analyzing various perspectives of the market with the help of Porter’s five forces analysis.
  • Study on the product type that is expected to dominate the market.
  • Study on the regions that are expected to witness the fastest growth during the forecast period.
  • Identify the latest developments, market shares and strategies employed by the major Advanced Packaging market players.
  • 3 months’ analyst support along with the Market Estimate sheet (in excel).

In this study, the years considered to estimate the market size of Advanced Packaging:

History Year: 2013-2017
Base Year: 2017
Estimated Year: 2020
Forecast Year 2020 to 2023

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