The Insight Partners has published a new research report on Global Redistribution Layer Material Market sizes, upcoming industry trends and growth opportunity through 2019-2027. This study comprises of prominent data which makes it a beneficial source for investors, analysts and industry experts to acquire necessary knowledge associated to the fundamental market trends, opportunities and growth drivers. The Redistribution Layer Material Industry Key Manufacturer, to describe, define and analyze the value, market share, trends, market demand, research, competition landscape, SWOT analysis and development plans in the coming years.
The global redistribution layer material market accounted to US$ 105.4 Mn in 2018 and is expected to grow at a CAGR of 25.7% during the forecast period 2019 - 2027, to account to US$ 794.5 Mn by 2027.
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The Key Players Profiled In The Market Include:
- Advanced Semiconductor Engineering, Inc. (ASE group)
- Amkor Technology, Inc.
- Fujifilm Holdings Corporation
- Hitachi Chemical DuPont MicroSystems L.L.C.
- Infineon Technologies AG
- Jiangsu Changjiang Electronics Technology Co., Ltd.(JCET)
- NXP Semiconductors N.V.
- Samsung Electronics Co. Ltd
- Shin-Etsu Chemical Co., Ltd.
- SK HYNIX INC.
- Sumitomo Bakelite Co., Ltd
- The Dow Chemical Company
- Toray Industries, Inc.
- Taiwan Semiconductor Manufacturing Company Ltd.
APAC was the leading geographic market and it is anticipated to be the highest revenue contributor throughout the forecast period. The presence of large semiconductor manufacturing industry in the countries like South Korea, China, Taiwan, and Japan, is expected to fuel growth of redistribution layer material market in this region.
The research thoroughly establishes critical market drivers, well-identified restraints, future opportunities, and ongoing trends of the market with essential statistics to provide precise data in terms of value and volume. The report focuses on the competitive landscape along with the SWOT analysis of some leading company profiles that have a significant impact on global market practices.
Manufacturing of consumer electronics, healthcare related products, automobiles, and defense industries are some of the prominent industry verticals that have been prolific in the automation integrations into the manufacturing assembly lines. Automation integration requires additional functionalities to be added on the chips for translating the manual operations to automated ones. Increasing the functionalities on chips while maintaining the size of the chip is made possible with the help of redistribution layer material and therefore, these manufacturing sectors are anticipated to drive the demands for redistribution layer material drastically during the forecast period.
The advent of IoT has enabled each device to be connected over the internet and the rising adoptions globally would result in more than billions of devices connected over the internet. Also, validating to the above mentioned point is the fact that the data traffic rate on a global level, has grown at an annual rate of more than 65% over the last five years. Also, between 2018 and 2023, the data traffic is anticipated to grow at a compound annual growth rate of close to 40 percent. This exponential growth in data traffic over the internet is out rightly attributed to the growing penetration of smartphones and other consumer electronic devices that can be connected over the internet as a result of the growing popularity of IoT.
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The global study on Redistribution Layer Material Market sums up area wise market distribution with respect to five major regions: North America, Europe, Asia-Pacific (APAC), Middle East and Africa (MEA), and South & Central America covering the political, economic, social, and technological scenario for each region and its impact on the market. The report further breaks down the analysis for the major countries in these regions to provide a detailed picture of the market share and growth rate.
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