Global Solder Ball Market Analysis Till 2024

The latest trending report Global Solder Ball Market 2019 by Manufacturers, Regions, Type and Application, Forecast to 2024 offered by DecisionDatabases.com is an informative study covering the market with detailed analysis. The report will assist reader with better understanding and decision making.

In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as ball or bumps) is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.

The worldwide market for Solder Ball is expected to grow at a CAGR of roughly 6.6% over the next five years, will reach 310 million US$ in 2024, from 210 million US$ in 2019.

This report focuses on the Solder Ball in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.

Browse the complete report and table of contents @ https://www.decisiondatabases.com/ip/21771-solder-ball-market-analysis-report

Market Segment by Manufacturers, this report covers

Senju Metal
DS HiMetal
MKE
YCTC
Nippon Micrometal
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology

Market Segment by Regions, regional analysis covers

North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

Market Segment by Type, covers

Lead Solder Ball
Lead Free Solder Ball

Market Segment by Applications, can be divided into

BGA
CSP & WLCSP
Flip-Chip & Others

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The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Solder Ball product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Solder Ball, with price, sales, revenue and global market share of Solder Ball in 2017 and 2018.
Chapter 3, the Solder Ball competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Solder Ball breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2014 to 2019.
Chapter 5, 6, 7, 8 and 9, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2014 to 2019.
Chapter 10 and 11, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2014 to 2019.
Chapter 12, Solder Ball market forecast, by regions, type and application, with sales and revenue, from 2019 to 2024.
Chapter 13, 14 and 15, to describe Solder Ball sales channel, distributors, customers, research findings and conclusion, appendix and data source.

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