semiconductor and electro
December 23, 2020

Electronic Packaging Market Estimated to Experience a Hike in Growth & Demand by Top Companies: Sealed Air Corporation, DuPont de Nemours, Quality Foam Packaging

Electronics packaging includes the packaging of the assortment of integrated circuits and other microcomponents in a single enclosure. Design and manufacturing activities for fabrication of components and devices in the consumer electronics industry has warranted its need for its protection. The global electronic packaging market report by Market Research Future (MRFR) comprises drivers, challenges, trends, and opportunities for the period of 2019 to 2025 (forecast period). The COVID-19 pandemic and its impact on the industry are highlighted in the report.

Market Scope

The global electronic packaging market is estimated to reach USD 2254.49 million by 2025, registering a CAGR of 16.10% during the forecast period. Huge demand for consumer electronics can be the primary driver of the market. The penetration of smart devices has induced the need for electronic packaging of integrated circuits and wafers of nano sizes to cater to a large consumer base. The advances in internet of things (IoT) and wireless devices can facilitate market growth over the forecast period.

Electronic Packaging Market@

Competitive Outlook

Major electronic packaging companies profiled are Sealed Air Corporation, DuPont de Nemours, Inc., Quality Foam Packaging Inc., UFP Technologies, Inc., Dordan Manufacturing Company, Kiva Container Corporation, STMicroelectronics NV, Primex Design & Fabrication, Plastiform Inc., The Box Co-Op, GY Packaging, Intel Corporation, AMETEK Inc., Samsung Electronics Corporation Ltd, AMS AG, Taiwan Semiconductor Manufacturing Co. Ltd., and Xilinx Inc.

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The global electronic packaging market has been segmented by material, packaging technology, and end-user.

·         By material, the market has been segmented into glass, plastic, metal, and others.

·         By packaging technology, the market has been segmented into chip-scale packages (CSP), through-hole mounting, and surface surface-mount technology (SMD).

·         By end user, the market has been segmented into telecommunication, consumer electronics, aerospace & defense, automotive, and others.

·         By region, the market has been segmented into North America, Europe, Asia Pacific (APAC), and Rest-of-the-World (RoW).

Regional Analysis

North America can occupy a significant market share owing to the proliferation of new communication technologies and large defense expenditure of prominent nations such as the U.S. and Canada. The use of drones, guided missiles, and satellites contain integrate circuits which beckon the use of electronic packaging. The ability to withstand harsh environments can drive its demand in the region.

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1.      Market Introduction

2.      Research Methodology

3.      Market Dynamics

4.      Executive Summary

5.      Market Factor Analysis

6.      Electronic Packaging Market, By Segments

7.      Competitive Analysis


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