December 23, 2019

Multilayered Flex Circuit Market: An Insight On the Important Factors and Trends Influencing the Industry

Multilayered flex circuits are fabricated by combination of multiple, single-sided and double-sided circuits. Between each combined circuit, three or more flexible conductive layers with insulating layers are provided. These layers are electrically interconnected by plated through holes (PTHs). Thus, high-density interconnection is achieved by using this technology. A multilayered flex circuit consists of conductors, insulators, adhesives, and finishes. Conductors such as aluminum, carbon, Inconel, and copper are commonly used. Similarly, among several insulating materials such as polyimide and screen-printed dielectric and polyethylene terephthalate, polyimide is widely used. Furthermore, acrylic and epoxy adhesives are most commonly used in multilayered flex circuits. Also, for finishing, carbon, silver, tin, or immersion gold are employed.

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While designing the circuit, certain design constraints need to be followed so as to avoid errors such as stray capacitance, crosstalk, and noise. These design considerations make it difficult to obtain a satisfactory level of performance from single-sided or even double-sided circuits. Since multilayered flex circuits perform under conditions wherein one or two layers of conductor fail, they are widely used in a variety of applications to fulfill circuit packaging and pin address requirements. Furthermore, for circuit requirements such as large circuit density, controlled impedance with shielding, and EMI/RFI shielding, multilayered flex circuits are preferred.

The design and manufacture of multilayered flex circuits require relatively less manual labor. This, in turn, reduces chances of errors in production. Also, it lessens the need for expensive soldering wires, routing, and wrapping. Moreover, multilayered flex circuits are light in weight and they require less space. Hence, they have reduced package size and overall weight. Owing to these advantages, multilayered flex circuits are widely used in several static as well as dynamic flexing applications such as tablets, smartphones, cameras, and other consumer electronic products. High demand for these products is driving the multilayered flex circuit market. Furthermore, in the consumer electronics sector, multilayered flex circuits have growth opportunities in electronic wearables and foldable or rollable smartphones.