Global Wafer Fabrication Market Research Report: By Equipment Type, By Fabrication Process, By End User and by Region - Forecast till 2025
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Market Synopsis
The Global Wafer Fabrication Market is expected to grow from USD 50.56 billion in 2018 to USD 62 Billion by 2025, at a CAGR of 4% during the forecast period. Wafer fabrication is a process of manufacturing different electronic components used in consumer electronic and other electronic and electrical devices. With the growing number of electronic devices over the last decade, the need for electronic components such as electronic circuits and semiconductors has increased.
Additionally, various government initiatives have encouraged companies to invest and establish manufacturing facilities locally. For instance, in 2016, the Government of India started ‘Make in India’ campaign and invited global companies to India to start their businesses. Therefore, the growing adoption of consumer electronics products and devices across the globe has led to the growth of the global wafer fabrication market.
Growing telecom industry contributes to the growth of the global wafer fabrication market. Rapid advances in technology and the advancements in network circulation from voice to integrated voice, video, and data have fueled the manufacturing of smartphones and other electronic devices used in network and telecommunication applications; this has resulted in higher demand for electronic components and fabrication process. Hence, growth in the telecom sector is one of the major factors contributing to the growth of the global wafer fabrication market.
Semiconductors or electronic circuits are used in every electronic device; these components undergo a complicated and time-consuming manufacturing process. Polycrystalline silicon is most commonly used raw material for wafer fabrication. Wafer fabrication process includes a series of steps and generally takes 10 to 30 days for completion. The steps involved in the fabrication process are thermal oxidation or deposition, masking, etching, doping, dielectric deposition and metallization, passivation, electrical test and assembly. Semiconductor equipment plays a vital role in integrated circuit (IC) manufacturing. Thus, semiconductor wafer fabrication is used to manufacture circuits, which are used in electronic and electrical devices.
Key Developments
- In March 2019, Tokyo Electron Limited announced the launch of ‘CELLESTA Pro SPM’ which is a single wafer cleaning system. This system can be used for wet metal etching with controlled selectivity for TiN and W films and post-ash clean processes.
- In July 2019, Applied Materials, Inc. acquired Kokusai Electric Corporation, a provider of high-productivity batch wafer processing systems and services for memory, foundry, and logic customers. This acquisition helps Applied Materials to increase its global services business and strengthen customer support capabilities.
- In July 2018, Tokyo Electron Limited announced the launch of ‘Triase+ EX-II Pro’ a single-wafer metallization system. This is a high-speed single wafer advanced sequential flow deposition system capable of depositing titanium nitride (TiN) and titanium silicon nitride (TiSiN) films.
Regional Analysis
The global wafer fabrication market is projected to grow at a significant rate during the forecast period from 2019 to 2025. The geographic analysis of the wafer fabrication market has been conducted for North America, Europe, Asia-Pacific, the Middle East & Africa, and Central and South America.
Asia-Pacific accounts for the largest market share due the presence of major semiconductor equipment manufacturers in this region. Also, the growing financial support and government initiatives in the region are encouraging companies to invest in the construction of new semiconductor fabrication plants in the region. North America is expected to be the fastest-growing regional market during the forecast period due to growing demand and high adoption of consumer electronics devices. The market in the Middle East and Africa is expected to show significant growth in the coming years.
Segmentation
The wafer fabrication market has been segmented on the basis of equipment type, fabrication process, end user, and region.
By equipment type, the global wafer fabrication market has been segmented into oxidation systems, diffusion systems, epitaxial reactors, photolithography equipment, ion implantation equipment, and others.
Based on the fabrication process, the global wafer fabrication market has been segmented into front end of line processing and back end of line processing.
Based on end-user, the global wafer fabrication market has been segmented into memory manufacturer and integrated device manufacturer.
The global wafer fabrication market, by region, has been classified into North America, Europe, Asia-Pacific, the Middle East & Africa, and Central and South America.
Competitive Analysis
The wafer fabrication market has witnessed a high demand globally due to the growth in the consumer electronics industry and technological advancements in the telecom and automotive sectors. Major players consider partnerships, new product launches, and development as a part of organic growth strategies to strengthen their position in the wafer fabrication market.
Key Players
The key players in the global wafer fabrication market are Lam Research Corporation (US), SCREEN Semiconductor Solutions Co., Ltd (Japan), Tokyo Electron Limited (Japan), SAMSUNG (South Korea), Applied Materials, Inc. (US), Hitachi High-Technologies Corporation (Japan), Motorola Solutions, Inc (US), Intel Corporation (US), KLA-Tencor Corporation (US), and ASML Holding NV (Netherlands).
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