September 18, 2019

Chemical Polishing Slurry Market size will increase to 1840 Million US$ by 2025

Chemical mechanical polishing/planarization (CMP) slurries are abrasive materials, also called non-crystalline inorganic oxides, which are dispersed in water blended with other chemicals and used in CMP processes for semiconductors. CMP process is employed in semiconductor manufacturing, where surfaces of wafers are smoothed and leveled with the help of abrasive slurries. This process is critical for precise lithography patterning, and is utilized after every deposition-etch step.

The Chemical Polishing Slurry (CMP) market has developed for several decades, and currently the global market is still dominated by few manufacturers from United States and Japan. Cabot Microelectronics is the largest producer, occupies for over 33 percent market share in the world, with manufacturing factories in US, Japan and Taiwan. The second-tier players are Hitachi Chemical, Fujimi Incorporated, Fujifilm, Dow Electronic Materials and Air Products/Versum Materials. The top six players occupy for over 88% market share.

Global Chemical Polishing Slurry market size will increase to 1840 Million US$ by 2025, from 1230 Million US$ in 2018, at a CAGR of 6.0% during the forecast period.

This study categorizes the global Chemical Polishing Slurry breakdown data by manufacturers, region, type and application, also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.

Report Sample includes:
- Table of Contents
- List of Tables & Figures
- Charts
- Research Methodology

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The following manufacturers are covered in this report:

  • Cabot Microelectronics
  • Dow Electronic Materials
  • Fujimi Incorporated
  • Air Products/Versum Materials
  • Fujifilm
  • Hitachi Chemical
  • Saint-Gobain
  • Asahi Glass
  • Ace Nanochem
  • UWiZ Technology
  • WEC Group
  • Anji Microelectronics

Chemical Polishing Slurry Breakdown Data by Type

  • Alumina Slurry
  • Colloidal Silica Slurry
  • Ceria Slurries

Chemical Polishing Slurry Breakdown Data by Application

  • Silicon Wafers
  • Optical Substrate
  • Disk Drive Components
  • Other Microelectronic Surfaces

Chemical Polishing Slurry Production Breakdown Data by Region

  • United States
  • Europe
  • China
  • Japan
  • Other Regions

Chemical Polishing Slurry Consumption Breakdown Data by Region

  • North America
  • United States
  • Canada
  • Mexico
  • Asia-Pacific
  • China
  • India
  • Japan
  • South Korea
  • Germany
  • France
  • UK
  • Italy
  • Russia
  • Rest of Europe
  • Central & South America
  • Brazil
  • Rest of South America
  • Middle East & Africa
  • GCC Countries
  • Turkey
  • Egypt
  • South Africa
  • Rest of Middle East & Africa

The study objectives are:

  • To analyze and research the global Chemical Polishing Slurry capacity, production, value, consumption, status and forecast;
  • To focus on the key Chemical Polishing Slurry manufacturers and study the capacity, production, value, market share and development plans in next few years.
  • To focuses on the global key manufacturers, to define, describe and analyze the market competition landscape, SWOT analysis.
  • To define, describe and forecast the market by type, application and region.
  • To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
  • To identify significant trends and factors driving or inhibiting the market growth.
  • To analyze the opportunities in the market for stakeholders by identifying the high growth segments.

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