3D ICs Market Foreseen to Grow Exponentially by 2027
The market for 3D ICs is set to grow exponentially with massive gains set to be met by 2027.
The utility segment is driven primarily by increasing global financial incentives and regulatory support. Currently used, the COVID-19 pandemic mainly affects the use of 3D ICs. Many business operations in China, the US, Germany and South Korea are delayed. In view of the supply chain limitations and lack of site access due to COVID-19 epidemic companies are experiencing short-term operating difficulties. The distribution of COVID-19 due to the pandemic impact in China, Japan and India is expected to be strongly influenced by Asia-Pacific.
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This study includes an in-depth business evaluation. This is done by detailed contextual analysis, historical data and verifiable market-size estimates. The predictions in the study were focused on existing research methodologies and assumptions. This research study serves as a repository for analysis and information for all market factors, not only regional market, technology, modes and applications but also for all aspects of the market.
The report provides an in-depth analysis of the major market players along with their business overview, expansion plans, and strategies. The main actors examined in the report are:
Tezzaron Semiconductor Corporation, 3M Company, Xilinx, Samsung, United Microelectronics Corporation, Taiwan Semiconductor Manufacturing Company, Ltd. and STMicroelectronics amongst others are some of the key competitors in this market.
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Market Breakdown:
The 3D ICs market is broadly segment into substrate types, components, fabrication processes and the end user industry. There are two kinds of substrate types viz., SOI (Silicon On Insulator) and bulk silicon. The Silicon-on-Insulator is capable of cutting down the excessive heat production & scrounging capacitance, resulting in high demand of SOI substrate type. Thus, SOI is expected to capture majority of the substrate revenue share in coming years. Memories, sensors, MEMS, LED and logic are some of the important fragments of components segment in the 3D ICs market. The growth in memory segment is attributed by the growing demand for devices with extended memory along with improvising trends and technologies. Also, the LED products are expected to attain boosting growth rate due to rising demand in LED based devices such as LED lighting, LED backlights in various display units. Moreover, LED products consume least power and offer better efficiency as compared to its competing technologies. The 3D memory segment is projected to dominate the market in coming years owing to the advancements in technology such as low power consumption and high storage capacity, which would increase the adoptability of DDR4 DRAM and 3D NAND in smart mobile devices and automotive products. According to the fabrication process, the market is fragmented into beam re-crystallization, silicon epitaxial growth, water bonding and solid phase crystallization. Due to its ability to produce thin ICs, water bonding is the highly utilized fabrication process.
Consumer electronics, ICT and military are some of the major key application areas of 3D ICs. Based on different end user applications, the 3D ICs market is anticipated to be dominated by ICT sector owing to the higher adoption rate of 3D ICs integration technology. Another major segment for the application of 3D ICs is consumer electronics because of the increasing demand for compact and efficient consumer electronics products.
On the basis of geographical boundaries, the market is classified into: North America (US and Canada), Europe (UK, Germany, France, Spain and Rest of Europe), Asia-Pacific (China, Japan, India, Australia, South Korea, and Rest of Asia Pacific), Latin America (Brazil, Mexico, and Rest of Latin America), Middle East and Africa (Saudi Arabia, UAE, and Rest of Middle East & Africa).
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