Wafer Backgrinding Tape Market to Offer Increased Growth Prospects for Manufacturers 2026

The global wafer backgrinding tape market size is expected to reach $261.42 million by 2026, growing at a CAGR of 4.90% from 2019 to 2026. Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits. It is the process of grinding the backside of the wafer to the correct wafer thickness prior to assembly. It is also referred to as wafer thinning. Most package types in the semiconductor industry today would require a wafer thickness ranging from 8 mils to 20 mils.

Wafer backgrinding tapes fully protect the wafer surface during backgrinding and also prevent wafer surface contamination from infiltration of grinding fluid. Usage of wafer backgrinding tapes in wafer fabrication ensures precision in wafer thickness after backgrinding. Wafer backgrinding tapes are mainly used in processing semiconductor wafers made from materials such as silicon or glass. Its powerful adhesive strength keeps wafers in place when grinding and cutting. Once the wafer has been processed, exposing the tape to ultraviolet light (UV) reduces its adhesive strength, making tape peeling or die pick up simple. On 14th March 2017, Furukawa Electric Co., launched “Plasma Masked Backgrind Tape” for laser grooving and plasma dicing. The tape is expected to improve the quality of chips and wafers.

Request a Report Sample with Toc and figures to click here: http://marketgrowthanalysis.com/reports/sample/259

Wafer Backgrinding Tape Market Segmentation:
By Type
UV Curable
Non-UV

By Wafer Size
6-Inch
8-Inch
12-Inch
Others

By Region
North America
U.S.
Canada
Mexico
Europe
UK

Request for enquiry on This Report at: http://marketgrowthanalysis.com/reports/enquiry/259


Germany
France
Russia
Rest of Europe
Asia-Pacific
China
Japan
Taiwan
South Korea
Rest of Asia-Pacific
LAMEA
Latin America
Middle East & Africa

The key players profiled in the report include Furukawa Electric Co. Ltd., Mitsui Chemicals, Inc., Nitto Denko Corporation, Minitron Elektron GMBH, Denka Company Limited, Lintec of America Inc., AI Technology, Inc., Force-One Applied Materials Inc., AMC Co, Ltd, and Pantech Tape Co., Ltd. These key players have adopted strategies, such as product portfolio expansion, mergers & acquisitions, agreements, geographical expansion, and collaborations to enhance their market penetration.

Browse more detail information about this report visit at: http://marketgrowthanalysis.com/wafer-backgrinding-tape-market

About Us:

Market Growth Analysis is one of the leading digital services provider and a result-oriented company based in Canada. We are a team of enthusiastic-driven individuals with top notch skills in SEO , Market research. Market Growth Analysis is a one stop shop to all your business needs. We help you thrive and succeed. We provide research solution.

Our digital and enterprise research assurance solutions are ideal for Automotive & Transportation, Electronics & Semiconductor, Chemicals & Materials, Healthcare, Pharmaceuticals & Medical Devices, Food & Beverage and Industrial Automation as well as all type of other leading industries verticals . We offer a vast line of in-depth study of industry trends including customized & client oriented specific requirement.

Our unique digital platform provides the services across the quality assurance research lifecycle on a 24X7 basis and delivers an unparalleled end-user experience for ‘mission critical’ products.

For any business solution, all you have to do is just ask and Market Growth Analysis will have a curated solution for you.

Contact US:

Unit 15A/7, capsquare residence

NO.02 persiaran capsquare

kuala lumpur, Malaysia

Postcode - 5000

Email: sales@marketgrowthanalysis.com

Website: http://www.marketgrowthanalysis.com