Semiconductor and IC Packaging Materials Market Competitive Dynamics & Global Outlook 2023
Semiconductor and IC Packaging Materials Market Scenario
Semiconductor and IC Packaging Materialss are used in the final stage of semiconductor device fabrication and are used to safeguard devices from deterioration and external influence. The global Semiconductor and IC Packaging Materials has perceived a noteworthy growth over the past few years owing to the growing demand for mobile phones, tablets, and other communication devices.
The Global Semiconductor and IC Packaging Materials Market is expected to grow at a CAGR of 5% during the forecast period.
The increasing implementation of integrated circuits in various electronic devices is prompting the demand for Semiconductor and IC Packaging Materials. Different types of material are used for the semiconductor packaging including organic substrates, bonding wires, encapsulation resins, ceramic packages, solder balls, wafer level packaging dielectrics, and others.
Key Players
The key players in the global Semiconductor and IC Packaging Materials Market are Henkel AG & Company, KGaA (Germany), Hitachi Chemical Company, Ltd. (Japan), Sumitomo Chemical Co., Ltd. (Japan), Kyocera Chemical Corporation (Japan), Mitsui High-tec, Inc. (Japan), Toray Industries, Inc. (Japan), Alent plc (U.K.), LG Chem (South Korea), BASF SE (Germany), Tanaka Kikinzoku Group (Japan), E. I. du Pont de Nemours and Company (U.S.), Honeywell International Inc. (U.S.), Toppan Printing Co., Ltd. (Japan), Nippon Micrometal Corporation (Japan), and Alpha Advanced Materials (U.S.)
The unremitting research and development exertions by major players in making the electronic packaging materials extremely dependable to intensify the growth of the global Semiconductor and IC Packaging Materialss. The increasing demand for consumer electronics is supplementing the market growth.
The rising consciousness about the practicality of electronic packaging materials in numerous applications is also contributing a significant boost to the growth of the market.
However, fluctuating prices of the raw materials are upsetting the growth of the market. On the basis of the region, the global Semiconductor and IC Packaging Materials market is segmented into North America, Asia Pacific, Europe, and Rest of the World.
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