Custom Electronic Packaging Market Business Overview, Challenges, Opportunities, Trends And Market Analysis By 2023
Summary
Global Custom Electronic Packaging Market By Material (Corrugated Boxes, Foamed Plastic, Paperboard, Bubble Packaging, Others), By Product Size (Small Appliances, Large Appliances), By Technology (Authentication Packaging, Track And Trace Packaging) And By Region - Global Forecast To 2023
Overview
The Custom Electronic Packaging Market, according to the recent report by Market Research Future (MRFR), is expected to grow over the CAGR of about 5% during the review period (2017 to 2023).
Competitive Analysis
The key market players of the Custom Electronic Packaging Market identified by MRFR are
- International Paper Company (U.S.)
- Mondi plc. (Austria)
- DS Smith Plc. (U.K.)
- Sealed Air Corporation (U.S.)
- Smurfit Kappa (Republic of Ireland)
- Georgia-Pacific LLC (U.S.)
- Graham Packaging (U.S.)
- Pregis LLC (U.S.)
- Dunapack Packaging (Austria)
- Sonoco Products Company (U.S.)
- Stora Enso (Finland), and others
Segmental Analysis
The global Custom Electronic Packaging Market is segmented on the basis of material, product size, and technology.
The types of materials used in the global Custom Electronic Packaging Market are bubble packaging, corrugated boxes, foamed plastic, paperboard, and others. Bubble packaging segment may grow up to a substantial market share over the review period, followed by a foamed plastic segment. The product size segment comprises of small appliances and large appliances. The technologies deployed in the market are authentication packaging and track and trace packaging.
Regional Analysis
The global market for electronic goods packaging is segmented, on the basis of region, into the Asia Pacific (APAC), Europe, North America, and lastly, the rest of the world.
The Asia Pacific region is one of the major regions of the market and is poised to hold the largest market share over the review period. This is attributed to the significantly improving economic scenario leading to rapid industrialization and population growth in evolving economies such as China, India, and Japan, among others. China and India lead the Asia Pacific Custom Electronic Packaging Market owing to their development as industrial bases, along with the expansion of electronics industry in these countries. Moreover, the growing consumption and demand for electronics due to the rising adoption of gadgets is creating promising conditions for the growth of the Asia Pacific Custom Electronic Packaging Market over the review period.
North America is followed by Europe, where countries such as Germany, France, and the UK are assessed as the major contributors towards market growth. The high demand and sale of electronic products contribute consequently to the need for electronic goods packaging.
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