July 31, 2020

Die Bonder Equipment Market Report by Manufacturers, Opportunities, Challenges, Drivers, Growth, Countries, Revenue, and Forecast

"Final Report will add the analysis of the impact of COVID-19 on this industry."

Global Die Bonder Equipment Market 2020 advanced analysis by Industry Research gives market share, size, revenue in value and volume. Industry Research also studies market status and outlook of Global and major regions, from angles of players, countries, product types and end industries.

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Die Bonder Equipment Summary:

Die bonding is the process of attaching a die/chip to a substrate or package. Die bonding is accomplished by using one of the following processes: 1. Eutectic; 2. Solder; 3. Adhesive; 4. Glass or Silver-Glass

Scope of Die Bonder Equipment Report:

  • Die Bonder Equipment industry is highly concentrated, manufacturers are mostly in the Asia, Europe and US. Among them, Europe output volume accounted for more than 32.09% of the total output of global Die Bonder Equipment in 2016. Besi is the world leading manufacturer in global Die Bonder Equipment market with the market share of 39.21%, in terms of revenue.
  • With the increasing in production capacity, expected that the Die Bonder Equipment raw material price will be stable in the short term. However, the improvement of energy, transportation costs, and labor costs, will play a significant role in promoting the cost of Die Bonder Equipment.
  • The average price of Die Bonder Equipment will fall further. The product average price trend in the past few years was not stable, however, due to the mature manufacturing technology, cost of raw materials, as well as the substitute threat, the average price will decrease in the few future years.
  • The worldwide market for Die Bonder Equipment is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2024, from xx million US$ in 2019, according to a new research study.

To Understand How COVID-19 Impact is Covered in this Report on Die Bonder Equipment Market

Major Players playing dynamic role in Die Bonder Equipment Market:

  • Besi
  • ASM Pacific Technology (ASMPT)
  • Kulicke & Soffa
  • Palomar Technologies
  • Shinkawa
  • DIAS Automation
  • Toray Engineering
  • Panasonic
  • FASFORD TECHNOLOGY
  • West-Bond
  • Hybond.

Segmentation Analysis:

Die Bonder Equipment Market Segment by Type, covers:

  • Fully Automatic
  • Semi-Automatic
  • Manual

Die Bonder Equipment Market Segment by Applications can be divided into

  • Integrated Device Manufacturers (IDMs)
  • Outsourced Semiconductor Assembly and Test (OSAT)

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Detailed TOC of Global Die Bonder Equipment Market 2019 by Company, Regions, Type and Application, Forecast to 2024: Table of Contents

1 Die Bonder Equipment Market Overview

1.1 Product Overview and Scope of Die Bonder Equipment

1.2 Classification of Die Bonder Equipment by Types

1.2.1 Global Die Bonder Equipment Revenue Comparison by Types (2019-2024)

1.2.2 Global Die Bonder Equipment Revenue Market Share by Types in 2018

1.3 Global Die Bonder Equipment Market by Application

1.3.1 Global Die Bonder Equipment Market Size and Market Share Comparison by Applications (2014-2024)

1.4 Global Die Bonder Equipment Market by Regions

1.4.1 Global Die Bonder Equipment Market Size (Million USD) Comparison by Regions (2014-2024)

1.4.1 North America (USA, Canada and Mexico) Die Bonder Equipment Status and Prospect (2014-2024)

1.4.2 Europe (Germany, France, UK, Russia and Italy) Die Bonder Equipment Status and Prospect (2014-2024)

1.4.3 Asia-Pacific (China, Japan, Korea, India and Southeast Asia) Die Bonder Equipment Status and Prospect (2014-2024)

1.4.4 South America (Brazil, Argentina, Colombia) Die Bonder Equipment Status and Prospect (2014-2024)

1.4.5 Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa) Die Bonder Equipment Status and Prospect (2014-2024)

1.5 Global Market Size of Die Bonder Equipment (2014-2024)

2 Manufacturers Profiles

2.1 Company 1

2.1.1 Business Overview

2.1.2 Die Bonder Equipment Type and Applications

2.1.2.1 Product A

2.1.2.2 Product B

2.1.3 Die Bonder Equipment Revenue, Gross Margin and Market Share (2017-2018)

2.2 Company 2

2.2.1 Business Overview

2.2.2 Die Bonder Equipment Type and Applications

2.2.2.1 Product A

2.2.2.2 Product B

2.2.3 Die Bonder Equipment Revenue, Gross Margin and Market Share (2017-2018)

3 Global Die Bonder Equipment Market Competition, by Players

3.1 Global Die Bonder Equipment Revenue and Share by Players (2014-2019)

3.2 Market Concentration Rate

3.2.1 Top 5 Die Bonder Equipment Players Market Share

3.2.2 Top 10 Die Bonder Equipment Players Market Share

3.3 Market Competition Trend

4 Global Die Bonder Equipment Market Size by Regions

4.1 Global Die Bonder Equipment Revenue and Market Share by Regions

4.2 North America Die Bonder Equipment Revenue and Growth Rate (2014-2019)

4.3 Europe Die Bonder Equipment Revenue and Growth Rate (2014-2019)

4.4 Asia-Pacific Die Bonder Equipment Revenue and Growth Rate (2014-2019)

4.5 South America Die Bonder Equipment Revenue and Growth Rate (2014-2019)

4.6 Middle East and Africa Die Bonder Equipment Revenue and Growth Rate (2014-2019)

… and continued

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